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Improving the Yield of Printed Circuit Boards Using Design of Experiments

Summary: [This abstract is based on the authors' abstract.] A designed experiment was conducted for optimizing the parameter levels in the inner-layer process of printed circuit board fabrication. The goal was to improve yield. A special test pattern with fine line circuits was designed. Eight process factors were studied using an L18 orthogonal array. Implementation reduced the rejection level to less than half of the previous level. This resulted in a savings of about US$50,000 per annum.

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  • Topics: Design of Experiments, Sampling
  • Keywords: Defects,Design of experiments (DOE),Sampling,Yield
  • Author: Maruthi, B. N.; Joseph, V. Roshan
  • Journal: Quality Engineering